Wafer surface cleaning after CMP process

- Capable of manufacturing and developing by wafer size(8 inch, 12 inch, 18 inch)
- Prevent shift phenomenon by utilizing pin between brush an core(patented technology)
- Capable of maintaining stable flatness by 3 times of flatness inspection, and cleaning scaling process
- Differential cleaning per device

8 inch : AMAT, EBARA, IPECunit : mm

ITEM OD L
MESA 70 216
Ontrak 60 241
Ebara 38 208

12 inch : AMAT, EBARA, KC TECHunit : mm

ITEM OD L
AMAT, KC TECH 70 320
Ebara 300S2 38 310
Ebara 300X 60 309

CMP Product

  • AMAT MESA 8inch
  • KC TECH 8inch
  • AMAT ONTRAK 8inch
  • EBARA 300X 12inch
  • EBARA 300S 12inch
  • NOVELLUS / IPEC
  • NOVELLUS / IPEC
  • AS-2000